Mar 13, 2024     Walmart has reportedly ended a pilot of new self-checkout technology. 

Since November 2023, the Arkansas-based retail has been piloting RFID tech. at a single store to verify a customer's purchase, allowing shoppers to leave without having to flash their proof of purchase to a worker at the Bentonville location.

During the test, customers could use the kiosk to scan the items in their carts, a Walmart spokesperson told Yahoo Finance on March 6. A blue marker would appear on the floor by the machine, directing customers to place their carts on the square. The machine contained a bagging area as signage around it encouraged shoppers to "Try our new, faster checkout."

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1) Super capacitors have a fixed polarity. Before use, confirm the polarity.

2) Super capacitors should be used at nominal voltage. When the capacitor voltage exceeds the nominal voltage, it will cause the electrolyte to decompose, at the same time the capacitor will heat up, the capacity will decrease, and the internal resistance will increase, and the life will be shortened.

3) Super capacitors should not be used in high-frequency charging and discharging circuits. High-frequency fast charging and discharging will cause the capacitor to heat up, the capacity will decrease, and the internal resistance will increase.

4) The ambient temperature has an important effect on the life of the supercapacitor. Therefore, super capacitors should be kept as far away from heat sources as possible.

5) When a supercapacitor is used as a backup power supply, because the supercapacitor has a large internal resistance, there is a voltage drop at the moment of discharge.

6) Super capacitors should not be placed in an environment with relative humidity greater than 85% or containing toxic gases. Under these circumstances, the leads and the capacitor case will be corroded, causing disconnection.

7) Super capacitors should not be placed in high temperature and high humidity environments. They should be stored in an environment with a temperature of -30 to 50 ° C and a relative humidity of less than 60% as much as possible. Avoid sudden temperature rises and falls, as this will cause product damage .

8) When a super capacitor is used on a double-sided circuit board, it should be noted that the connection cannot pass through the capacitor's reach. Due to the way the super capacitor is installed, it will cause a short circuit.

9) When the capacitor is soldered on the circuit board, the capacitor case must not be contacted with the circuit board, otherwise the solder will penetrate into the capacitor through hole and affect the performance of the capacitor.

10) After installing a super capacitor, do not forcibly tilt or twist the capacitor. This will cause the capacitor leads to loosen and cause performance degradation.

11) Avoid overheating capacitors during soldering. If the capacitor is overheated during welding, it will reduce the service life of the capacitor.

12) After the capacitor is soldered, the circuit board and the capacitor need to be cleaned, because some impurities may cause the capacitor to short circuit.

13) When supercapacitors are used in series, there is a problem of voltage balance between the cells. A simple series connection will cause one or more individual capacitors to overvoltage, which will damage these capacitors and affect the overall performance. Therefore, when the capacitors are used in series, , Need technical support from the manufacturer.

14) When other application problems occur during the use of supercapacitors, you should consult the manufacturer or refer to the relevant technical data of the supercapacitor's instructions.

1. Ceramic chip capacitor failure caused by external force

(1) Because the ceramic chip capacitor is brittle and has no pin, it is greatly affected by the force. Once it is affected by the external force, the internal electrode is easy to break, resulting in the failure of the ceramic chip capacitor. As shown in Figures below, the capacitor end of ceramic patch is broken or damaged due to any external force. For example, in the process of mechanical assembly, the printed circuit board assembly is installed in the box, and the electric driver is used for assembly. At this time, the mechanical stress of the electric driver is easy to disconnect the capacitor. 

(2) Due to the quality problem of poor bonding force of ceramic chip capacitor end (body and electrode), the metal electrode is easy to fall off through the process of welding, warm punching, debugging and other external forces, that is, the body and electrode are separated, as shown in Figure as below.

 2. Failure caused by improper welding operation

(1) It is very common that the thermal shock of ceramic chip capacitor caused by improper manual welding or rework of electric iron.

When welding, there will be thermal shock. If the operator contacts the tip of the soldering iron directly with the electrode of the capacitor, the thermal shock will cause the micro crack of the ceramic chip capacitor body, and the ceramic chip capacitor will fail after a period of time. In principle, the SMT should be welded by hand. Multiple welding, including rework, will also affect the solderability of the chip and the resistance to welding heat, and the effect is cumulative, so it is not suitable for the capacitor to be exposed to high temperature for many times

(2) The tin on both ends of the capacitor is asymmetric during welding.When welding, the tin on both ends of the capacitor is asymmetric, as shown in below figure.

The tin on both ends of the capacitor is asymmetric. When the capacitor is subjected to external force or stress screening test, the ceramic patch will be seriously affected due to excessive soldering. The capacitor's ability to resist mechanical stress will lead to cracking of the body and electrode and failure.

(3) Too much solder

The factors related to the degree of mechanical stress of multilayer ceramic chip capacitor on PCB include the material and thickness of PCB, the amount of solder and the position of solder. Especially, too much solder will seriously affect the ability of chip capacitor to resist mechanical stress, resulting in capacitor failure.

3. Capacitor failure caused by unreasonable pad design

(1) The design of the pad is unreasonable, as shown in below Figure, when there is a hole in the pad. Solder will lose (there is such design phenomenon in the product), which causes welding defects due to the asymmetry of solder at both ends of capacitor. At this time, stress screening or external force will be conducted. The stress released at both ends of ceramic chip capacitor will easily cause cracking and failure.

(2) Another pad design is shown in below Figure. When using on-line welding, the size of pads at both ends of the capacitor is different or asymmetric (this design phenomenon exists in the product), the amount of solder paste printed is quite different. The small pad has a fast response to temperature, and the solder paste on it melts first. Under the action of solder paste tension, the component is straightened up, resulting in "upright" phenomenon or solder asymmetry, causing capacitor failure. One end of several ceramic chip capacitors share a large pad. If one capacitor at the common end needs to be repaired or one of the capacitors fails and needs to be replaced, one end of the other components will also experience a thermal shock, and the capacitor is prone to failure.

4. Failure caused by high and low temperature impact test

During the test, the thermal expansion coefficient (CTE) of PCB, MLCC end electrode and ceramic dielectric is small, and the chip capacitor is subjected to certain thermal stress due to the rapid change of cold and hot. The body (ceramic) and electrode (metal) of SMC produce stress cracks, which lead to the failure of SMC.

5. Failure caused by mechanical stress

Improper operation of the printing plate in the assembly process will cause mechanical stress, which will lead to capacitor rupture, and the pad is designed near the screw hole, which is easy to cause mechanical damage during assembly. This kind of damage makes the crack expand further in the temperature shock test, which leads to the capacitor failure. It can be seen from the structure that MLCC can withstand large compressive stress, but its bending resistance is poor. Any operation that may produce bending deformation during capacitor assembly will lead to component cracking.

Hermetically Sealed High Energy Tantalum Capacitor is high-performance, high-energy density, low impedance and full sealing. With the innovative multi-anode parallel structure, the self-impedance of the capacitor is significantly reduced, resulting in lower heat generation and higher reliability during high-power-density charging and discharging. Additionally, it can be used in circuits with some AC components for discharging and dual-purpose filtering as a filter and power compensation device.

To ensure high reliability during usage, please take note of the following points.

1. Test

1.1 Hermetically Sealed High Energy Tantalum Capacitor is a polar component, the polarity must not be reversed during use and testing. If the polarity is reversed, the reliability of the capacitor will be irreversibly damaged and cannot be used anymore.

1.2 Capacitance & Dissipation Factor Measuring Conditions: 1.0Vrms@100Hz

1.3 Equivalent Series Resistance（ESR）：measuredat1000Hz,1Vrms

1.4 Leakage current test: Apply rated voltage or class voltage for 5min. The qualified standards for leakage current can be found in the product specifications and corresponding specifications.

1.5 Professional testing instruments and fixtures must be used. A multimeter cannot be used to test any parameters of hermetically sealed high energy tantalum capacitor. It is not possible to use a multimeter to test it regardless of polarity.

1.6 Hermetically sealed high energy tantalum capacitor can store a high amount of electrical energy, after conducting a leakage current test, the capacitor must be thoroughly discharged by a standard leakage current tester before use.

Discharge resistance: 1000 ohms;

Discharge time: ≥ 5mins

Residual voltage after discharge：＜1V

1.7 Test of electrical performance must be carried out in the following order and cannot violate.

Test sequence: Capacitance & Dissipation Factor - ESR - Leakage Current – Discharge

2. Precautions for use on different circuits

2.1 Delay protection circuit

The capacitors used in such circuits primarily serve as backup power for unexpected power outages, requiring them to automatically engage when the main power source suddenly fails. They must maintain a specified power supply duration under certain voltage and power density requirements. When designing circuits of this nature, please pay attention to the mathematical relationship between the total impedance of the capacitor's downstream circuit and the required voltage, capacitor capacity, and power needs. Additionally, during the design phase, it is advisable to leave at least a 50% margin in capacitor capacity selection to ensure that there is enough power supply time and power density in case of unforeseen factors. The specific calculation is as follows:

When the circuit is working normally,

Input power: P

Capacitance: C

Voltage at both ends: U1

Then, the energy stored by the capacitor is

 W1=C（U12）/2

Where U12 represents the square of U1.

When the input power supply drops out, after a time t, the voltage at both ends U2,

Then, the remaining energy of the capacitor is

W2=C（U22）/2

The energy released during this process:

W=W1-W2=C（U12-U22）/2

It should be equal to the energy required to keep the circuit working properly:

W=Pt（i.e. input power multiplied by time）

Therefore,

C（U12-U22）/2=Pt

From this, the minimum capacitance required for the circuit maintenance time t can be obtained as:

C=2Pt/（U12-U22）

In practical applications, U2 is the minimum input voltage that a circuit can operate normally.

Example:

If when the circuit is working normally, the input voltage is 28V (U1), the input power is 30W (P), and the minimum input voltage that can work normally is 18V (U2). It is required that the circuit can still work even after a 50 millisecond (t) power drop-out from the input power supply, then the minimum capacitance required for energy storage capacitance is

C=2Pt/（U12-U22）

 =2×30×50/（282-182）

 =3000/（784-324）

 =6.522mF=6522μF

An energy storage capacitor used in the front end of a power supply circuit has an input voltage of 50 V. When the power is cut off, the capacitor begins to supply energy to the subsequent circuit, and the voltage must be maintained at not less than 18 V while supplying energy for 75 W. Calculate the required capacitance.

This circuit also requires an accurate loop resistance. The size of the circuit resistance determines the required capacity of the capacitor.

The conversion formula for the performance of each parameter in this circuit is as follows:

C=R×PT×T/(U1-U2)

In the equation:

C: Required capacitance (F)

R: Total circuit resistance (Ω)

Pt: The power that the circuit needs to maintain (W)

T: Loop power holding time (s)

U1: Input voltage (V)

U2: Voltage that can maintain a certain power and discharge time (V)

The capacitor used in such circuits must be derated to within 70% of the rated voltage.

2.2 Charging and discharging circuit

Due to its high energy density and low impedance characteristics, this capacitor is the best choice for high-power discharge circuits. The hermetically sealed high energy tantalum capacitor used in such circuits can still achieve high power density infinite charging and discharging under certain conditions and still has high reliability. It is the best instantaneous power supply.

In such circuits, the relationship among the capacitance of capacitors, the output power density and load power can be calculated by referring to clause 2.1.

In this type of circuit, the maximum discharge current I to which the capacitor can be subjected individually must not exceed 50% of the current value calculated in the following formula;

Due to the inherent thermal equilibrium issue that capacitors inevitably face during high-power discharges, the maximum DC current pulse that tantalum capacitors can safely withstand in a DC high-power discharge circuit with a fixed impedance is determined by the following formula:

I=UR /（R+ESR）

In the equation:

I: Maximum DC surge current (A)

R: The total impedance of the circuit for testing or discharging (Ω)

UR: Rated voltage (V)

ESR: Equivalent series resistance (Ω)

From the above formula, it can be observed that if a product has a higher ESR (Equivalent Series Resistance), its safe DC surge current capability will be reduced. This also implies that if one product has half the ESR of another, its resistance to DC surge will be twice as high, and its filtering characteristics will be better as well.

When using capacitors in such circuits, since the capacitors operate continuously at high power levels, the actual operating voltage should not exceed 70% of the rated voltage. Considering the impact of heat dissipation on reliability, it is even better to derate the usage to below 50% for higher reliability.

Furthermore, when using this type of capacitor in such circuits, due to the high operating current, the capacitor will experience some heating. When designing the capacitor's placement, it is essential to ensure that it is not positioned too close to other heat-sensitive components. Additionally, the installation space for this capacitor must have good ventilation.

2.3 Filtering and power compensation for the power supply secondary 

The allowable AC ripple value of the capacitor used in such circuits must be strictly controlled. Otherwise, excessive AC ripple can lead to significant heating of the capacitor and reduced reliability. In principle, the maximum allowable AC ripple value should not exceed 1% of the rated voltage, the current should not exceed 5% of the maximum permissible discharge current, and the maximum allowable operating voltage of the capacitor should not exceed 50% of the rated voltage.

3. Derating design of hermetically sealed high energy tantalum capacitor

In general, the reliability of capacitors is closely related to the operating conditions of the circuit. To ensure an adequate level of reliability during usage, it is essential to adhere to the following principles:

3.1 Reduce more rather than less

Because the greater the derating of capacitors, the higher the reliability in handling unexpected power shocks. Additionally, derating design should be based on reliability under possible extreme usage conditions, such as high operating temperatures, high ripple currents, and significant temperature and power fluctuations.

3.2 Select large capacity rather than small

The larger the capacitance, the higher the instantaneous electrical energy it can provide. Additionally, since this capacitor falls under the basic category of tantalum electrolytic capacitors, it experiences greater capacity loss at low temperatures (compared to solid tantalum capacitors). Therefore, the capacity selection should be based on the capacity at extreme negative temperatures. This is particularly important for capacitors used at high altitudes. Specific capacity variations at low temperatures can be found in the product specifications and relevant standards.

3.3 Selection of Impedance

For circuits used in situation 2.3, it is essential to choose products with a lower ESR whenever possible for higher reliability and improved filtering performance.

3.4 Selection of Capacitor Size

Due to the fact that smaller products with the same capacity and voltage must be manufactured using tantalum powder with higher specific capacity, the ESR of the product will be higher, and the leakage current will also be greater. Therefore, the reliability of the product will be lower than that of larger products. When installation space allows, products with larger volumes should be used as much as possible to achieve higher reliability.

4. Installation

4.1 Installation ways 

The positive lead wire of hybrid energy tantalum capacitors cannot be directly welded to the circuit board, but must be welded to the circuit board through the external lead wire. High energy tantalum composite will be present.

There are three ways to install the circuit board, as shown below:

Figure 1：Installation mode of single negative pole lead (fixed by mounting frame)

 Figure 2：Double negative or triple negative lead installation mode (fixed by negative lead)

Figure 3：Double screw or triple screw installation (fixed by screw)

4.2 Considerations for Installation Method Selection 

Due to the relatively large mass and size of this capacitor, it is advisable to adhere to the following principles during installation:

（a）For specifications with large size and mass, standard mounting brackets provided by the manufacturer should be used as much as possible to ensure that the connection between the product and circuit will not experience instantaneous open circuits when the equipment encounters large vibrations and overload impacts, and also to ensure installation strength requirements.

(b) For conditions where size and mass are relatively small and there are stringent requirements for installation space, capacitor products with built-in mounting bolts can be used. For such installations, it is essential to ensure that the circuit board has a high level of strength. Additionally, after tightening the mounting bolts, epoxy-based sealant must be used to secure the bolts. If conditions allow, other forms of fastening (such as applying adhesive to the capacitor base) can also be employed to ensure that the capacitor's mounting strength meets the requirements for extreme conditions of use.

(c) For products used in high-power continuous discharge circuits, capacitors should not be installed too close to devices with significant heat dissipation to prevent the capacitor from overheating and experiencing reduced reliability. Additionally, capacitors used in such circuits should not have heat-insulating sealant coatings applied to their casings to avoid a decrease in heat dissipation performance, which could lead to increased temperatures and reduced reliability of the capacitors.

(d) For products used in high-power uninterrupted discharge circuits, it is essential to have good ventilation conditions to ensure that the heat generated by the capacitors can be promptly expelled, preventing excessive temperature rise of the capacitors.

(e) The anode lead of hermetically sealed high energy tantalum capacitor is connected to the casing with an insulating ceramic material. Therefore, during installation, the positive lead that is fixed to the circuit board must be connected using nickel-based leads that are soldered on; it is not permissible to directly solder the excessively short tantalum leads onto the circuit board. This is because short positive leads can compromise the capacitor's seal when subjected to high overload and high-frequency vibrations, leading to leakage and capacitor failure.

5. Circuit protection

5.1 If the selected capacitor operates at a frequency with significant power variations, it is advisable to implement overload protection in the power supply circuit providing energy compensation to the capacitor. This helps prevent overloading of the power supply when there is a sudden surge in starting current.

5.2 The circuit in which this capacitor is used must have reverse voltage control and a separate discharge path to prevent the capacitor from experiencing reverse surges during operation and shutdown. The energy stored in the capacitor should be correctly discharged after use.

Barcode Scanner is generally divided into three interfaces, namely the USB interface, serial port and keyboard.

1. USB's keyboard mode: It is the same as the USB keyboard. After connecting the scanned gun to the computer, we start to scan the bar code and find that the computer's cursor is located. There is a data input. No matter what software is, as long as the keyboard can be entered, you can scan into the data. The USB keyboard does not need to drive, so the barcode scanning gun that is similar to the USB keyboard does not require driving.

2. USB's serial port mode: In the factory, it is generally used in the factory. For some places with special requirements, you also choose to transmit serial port. This method needs to install the driver. This driver is the driver of the USB transitional chip, and some will be divided into 32 -bit drivers and 64 -bit drivers according to the system. If you want to scan the QR code containing Chinese, you must scan in a serial port. If there is no corresponding software to receive data, you need some small software to pass the data received by the serial port to the cursor.

3. USB HID mode: This method is similar to the USB serial port mode, and it is necessary to install the driver and receive data from the special software from the HID interface.

In retail warehousing management, the barcode solution is adopted. When using barcode scanning guns, pay attention to this: the barcode scanning gun of the serial port cannot be used to use notepads, Excel, Word, etc. The computer comes with it, Win7 is not).

Key step:

1. First connect the data cable to the data cable socket and computer USB port of the barcode scanning gun (the connection method of other interface scanning guns is slightly different, and you can refer to the user manual).

2. Press and hold the trigger key. The lighting light is activated. The red lighting area and the red focus line appear.

3. Met the red focus line on the barcode center, move the scanning gun and adjust the distance between it and barcode to find the excellent knowledge reading distance.

4. Hearing a successful prompt sound, and at the same time, the red lighting line goes off, then the code reads successfully. The scanning gun transmits the decoded data to the host.

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In today's healthcare systems, ensuring the utmost safety and efficiency in surgical procedures is of paramount importance. To address this need, the application of Radio Frequency Identification (RFID) technology has emerged as a valuable tool. RFID tags, along with RFID readers, enable the full process traceability of surgical patients from admission to discharge.

RFID technology allows for the automatic identification and tracking of surgical patients throughout their entire hospital journey. Each patient is equipped with a unique RFID tag containing relevant information such as medical history, allergies, and treatment plan. By using RFID readers, healthcare professionals can easily access this information, leading to improved patient care and reduced medical errors.

One application of RFID technology is the use of tag RFID readers located at strategic points within the hospital. These long-range RFID readers can detect and capture patient data in real-time as they move through different areas, such as preoperative, operating rooms, and postoperative recovery. This enables healthcare staff to have instant access to crucial patient information, facilitating seamless coordination and timely decision-making.

Furthermore, handheld RFID readers with displays take the accessibility of patient information to another level. These portable devices provide healthcare providers with the flexibility to scan RFID tags and instantly view relevant patient data on the device's screen. This feature proves particularly useful during emergency situations or when immediate access to patient information is required. Doctors and nurses can make informed decisions at the point of care, enhancing patient safety and overall treatment outcomes.

The implementation of RFID technology in surgical patient tracking offers numerous advantages. It improves patient safety by reducing the likelihood of medical errors due to misidentification or lack of vital information. It enhances workflow efficiency, allowing healthcare professionals to optimize their time and resources. Additionally, it streamlines communication and collaboration among healthcare teams, leading to better coordination and overall patient care.

In conclusion, RFID technology, with the utilization of RFID tags, long-range RFID readers, and handheld RFID readers with displays, brings about significant advancements in surgical patient traceability. This technology empowers healthcare professionals to deliver high-quality care by ensuring accurate patient identification, efficient information exchange, and seamless workflow management throughout the entire surgical process.

As necessary items for patients’ lives, the design of drug packaging should not only meet the  needs of ordinary people, but also consider the special needs of visually impaired people when using  drugs. In view of the problems such as difficulty in identifying and information clarity when using drugs for visually impaired people, relying on the digital technology of intelligent packaging, through the intelligent  packaging cloud platform, the barrier-free design of drug packaging for visually impaired people was  studied from three directions: barrier-free drug information identification, barrier-free drug use process and barrier-free emotional adaptation. The advantages of easy intelligent packaging identification, humancomputer interaction and data analysis were given full play to help guide visually impaired people to use  drugs and achieve the design expectation of barrier-free drug use for visually impaired people.

Packaging digital to packaging as a carrier, through the electronic sensory components, so that packaging to achieve information interaction, data analysis, real-time communication and other functions. Covering barcode and two-dimensional code in pharmaceutical packaging is gradually becoming popular, but visually impaired people will have obstacles and difficulties when using the skills required within the range of vision, such as colour weakness of people with low sensitivity to colours, and it is difficult for blind people to know where the scanning code is, RFID and NFC technology provides visually impaired people with the possibility of information recognition without barriers. RFID is a non-contact automatic identification technology, which uses radiofrequency signals to identify commodities and electronic tags on the packaging to obtain relevant data. RFID is a non-contact automatic identification technology that uses radio frequency signals to identify electronic tags on the packaging of goods in order to obtain relevant data.

By installing RFID on pharmaceutical packaging, visually impaired people can access information about their medicines without scanning in a particular direction and without the need for a scanner. information, the visually impaired person does not need to scan in a particular direction, no need to visualise the mobile device can be used to RFID has low light requirements and can transmit information over long distances. RFID requires less light and can transmit information over long distances, making it easier for the visually impaired to identify drug information. NFC is a form of peer-to-peer communication. NFC is a kind of integrated inductive card chip with peer-to-peer communication function. NFC is a kind of integrated sensor chip with point-to-point communication function, which is implanted in the medicine package to meet the special needs of the visually impaired people. NFC chip technology is implanted in pharmaceutical packaging for the special needs of the visually impaired, and works in conjunction with RFID technology. Through mobile terminals, NFC can realise mobile phone payment, identification, checking and anti-counterfeiting functions. NFC is used in mobile terminals for mobile phone payment, identification, checking and anti-counterfeiting functions.

More and more mobile phones and mobile devices support the provision of NFC functions. More and more mobile phones and mobile devices support the provision of NFC functions, providing sufficient preconditions for NFC to be embedded in pharmaceutical packaging. Visually Impaired The use of smart packaging for medicines with NFC function is simple, no need to scan, very fast, and real-time data is available. It is very fast and easy to scan, and real-time data can be exchanged. The device can point to the pharmaceutical packaging to obtain labelling information such as packaging code, name, ingredients and so on. The smart terminal device can point to the package to obtain labelling information such as package code, name, ingredients, etc., and can also listen to the information with the accompanying Bluetooth headset, which can help to It can also use Bluetooth headphones to listen to the information, which helps to protect the privacy of patients.

2.2 Comprehensive Information Sensing Technology

To meet the needs of different groups of people, pharmaceutical packaging needs to have a selection of targeted sensing technologies for packaging. packaging, making full use of multiple combined sensing system. For example, for drugs with very strict restrictions on storage temperature, the drug packaging can use TTI technology. T T I technology can be used in intelligent packaging, which can effectively detect the temperature in the pharmaceutical packaging environment. The intelligent packaging can effectively detect temperature changes in the pharmaceutical packaging environment and make timely warnings, reducing the omission of manual inspection. It can effectively detect temperature changes in the pharmaceutical packaging environment, provide timely warning and reduce the omission of manual inspection. For drugs that cannot be exposed to light and oxygen for a long time, TTI technology can be installed. For drugs that cannot be exposed to light and oxygen for a long time, light-sensing devices and carbon dioxide sensors can be installed to detect the storage status and openness of the drugs in time. The storage status of the drugs and the use of the drugs after opening can be detected in time, and sound warning can be provided to avoid problems. The installation of light-sensitive devices and carbon dioxide sensors can detect the storage status of medicines and their use after opening in a timely manner. This ensures the safety of medicines by providing audible warnings of problems with medicines, avoiding improper use of medicines by visually impaired people with vision problems.

This study was conducted to establish a new type of the archive management system of ancient and famous trees so as to solve the problems of errors and low efficiency in traditional archive management, while with more and more types and quantities of archive materials. RFID was used to realize the management of file storage, inspection, inventory and failure, for this technology could effectively reduce the manual operation, improve the operation efficiency and realize the automatic and intelligent management of files.

Besides, combined with various sensors, this technology could realize the dynamic real-time monitoring of the archives warehouse, and provide a good storage environment for the ancient and famous tree archives. The intelligent archives management system of ancient and famous trees in Ji’nan based on RFID technology was established by using RFID and Internet of Things technology, combined with information materials, such as the ancient and famous tree resource investigation, identification and protection, maintenance and rejuvenation, daily management, migration approval and so on.

Old and valuable trees are priceless treasures left to mankind by nature and predecessors, with important resource value, humanistic value, historical value, cultural relics value, ornamental value, ecological value and greening scientific research value Combining RFID technology and digital archives construction with scientific management of archives entities to realize a scientific, efficient and highly modernized management of archives construction of the new model has become possible. As an emerging identification technology, RFID technology is widely used in material

As an emerging identification technology, RFID technology is widely used in the fields of material tracking, production automation control, warehousing management, railroad vehicles and freight container identification, etc. [5]. With the increasing maturity of RFID technology, RFID application in archive management, has its reference and feasibility.

RFID-based ancient and valuable trees intelligent archive warehouse management system architecture is mainly divided into data collection, data transmission, data storage and business applications at four levels

Data collection layer is mainly the use of RFID technology, combined with desktop card issuer, file intelligent cabinet, printer, temperature and humidity sensors, water leakage sensors, after the external sensors and other equipment, real-time reading of old and valuable trees file tag information, realizing real-time supervision of the file; data transmission layer is the use of the system's internal network data transmission; data storage layer is the use of the project's servers and the government cloud storage of the mutual backup, to ensure that the archives Data storage layer is the server used in the project and the government cloud storage mutual backup, to ensure the security of the archive data; business application layer is through the cloud computing technology and software development technology, to realize the business application requirements of multi-user.

The RFID-based intelligent archive management system for old and valuable trees mainly consists of four modules: intelligent cabinet management, archive management, security management and dynamic environment monitoring.

Intelligent archive management can provide more convenient archive access experience. Through RFID tags, you can quickly find the required files and realize instant access through the intelligent storage system.

Making full use of RFID technology, it effectively reduces manual operation, improves operation efficiency, and realizes automation and intelligent management of archives; combining with various sensors, it realizes real-time monitoring of the dynamic environment of the archive storage room, and provides a good storage environment for the archives of old and valuable trees.

With the development of science and technology, various smart products are being updated. For example, the common HDMI cables in daily life have also undergone 2K, 4K, and 8K changes. The latest standard has been supported to 8K, even 10K, so many versions How to choose when buying wire? Today, Dtech will introduce to you the features of Dtech continuously upgraded HDMI cables! See which one you like more?

1. Dtech HDMI 4K 60Hz HD cable (DT-H001)

This HDMI HD cable supports 3D special effects 4K HD, simultaneous audio and video transmission, helping you build your own home theater, and you can experience the immersive excitement of 3D visual effects at home!

The wire body is made of PVC environmental protection material, the wire core is made of high-quality oxygen-free copper wire core, and the high-density aluminum-magnesium wire braided mesh shield + aluminum foil double-layer shielding truly ensures the safe and stable transmission of signal data. The plug adopts a gold-plated process to effectively reduce resistance and Anti-corrosion effect, more stable signal, non-slip bumps resistant to plugging, durable

2. Dtech Cinematic Fiber HDMI Cable 4K60Hz Engineering Model (DT-HF503)

Dtech HDMI 4K@60Hz high-definition cable, the transmission bandwidth and rate can reach 18Gbps, the frame rate can be increased to 60Hz, and the transmission distance can reach 300 meters, which is much longer than the previous version. Snow, black screen and other phenomena.

The high-definition wire core adopts high-quality optical fiber core, with twisted all copper wire, light-speed transmission, to ensure signal transmission, and decoration and embedding do not have to worry about signal problems! The wire body is made of selected environmentally friendly PVC materials, delicate and soft, easier to wire, one-piece molding, flexible, compact and easy to store!

Guangzhou Dtech Electronics Technology Co., Ltd

HDMI Cable

HDMI Fiber Cable

HDMI 4K 30Hz Fiber Cable